We supply the finest in fully refurbished wire bonders, and other semiconductor assembly equipment, to the Integrated Circuit, Hybrid, and Opto-Electronic industries.

Our new Q2119 Automatic Ball Bonder and Q2170 Automatic Wedge Bonder include such capabilities as Fine Pitch, Large Table Travel, and Ball Bumping
for Flip Chip, as well as Customizable Software.

In addition to the ‘Q’ series bonders, we offer a full line of manual and automatic wire bonders from such companies as Kulicke & Soffa ( K&S™ ), Orthodyne™, ESEC™, and Mech-El™.

For a specific wire bonder or wire bonding requirement, including training, service, or repair, please contact us.

Questar Products International, Inc.
1258-F Quarry Lane | Pleasanton, CA 94566
P: (925) 461-0100 | F: (925) 461-0200
email: info@questarinc.com

Point-Click-Bond!
Introducing the new Questar Q2119 and Q2170 Wire Bonders. Designed for Opto-Electronic, Hybrid, Monolithic, C.O.B. and Custom Semiconductor Devices.



©Copyright 2003 Questar Products International, Inc.