Q2119 and Q2170 Automatic Wire Bonders

INCREASE ACCURACY, RELIABILITY, and USEABILITY

REDUCE MAINTENANCE AND TRAINING COSTS

Questar Products has re-engineered and modernized the industry proven K&S 1419 and K&S 1470™ to create a more productive, easy to maintain and very user friendly new line of ball and wedge bonders.

These current technology machines provide a moderately priced, cost effective, large area bonding solution with features needed for complex hybrid, opto-electronic, medical, and other single or multichip devices.

We offer turn-key installations, as well as the remanufacturing of customers' existing equipment.

Our new machines include such state of the art features as:

• Point and Click Bonding
• Fast, Accurate PRS
• Fine Pitch Capability
• Ball Bumping and Coining Capability
• Programmable Security Bonds
• Large 4" X 4" Bonding Area
• Simple, Intuitive Programming
• Easy Bond Process Editing
• Extensive Program Storage
• Bond Parameter Library
• Flat Panel Monitor
• Solid State Vision System
• Galil Motion Control System
• Matrox Imaging Pattern Recognition System
• Pentium Computer with Windows 2000 OS

WE ALSO OFFER CUSTOM SOLUTIONS FOR UNIQUE APPLICATIONS