Q7000 series automatic wire bonders

Model Q7700 Gold Ball Bonder / Model Q7800 Wedge Bonder

Filling a growing need for affordable high performance equipment in the multi-chip, sensor, opto-electronic and specialty component wire bonding industry, these fine pitch automatic wire bonders simplify set-up and drastically reduce changeover time. To find out how user-friendly the Q7000 series is, or for complete information on all Questar products, contact Questar.

• Fully automatic, fine pitch wire bonders capable of bonding .0007" to .003" diameter wire.
• Convenient, rapid changeover design allows package conversions in as
  little as 3 minutes and accommodates a multitude of device configurations.
• Standard and customizable workholders available.
• Simplified menu driven software is easy to program and provides
  convenient access to all machine functions. 
  
  *Workholders ordered separately.   View Q7700 Specs    View Q7800 Specs 

View brief user-friendly wedge bonder product video in automatic mode

View brief user-friendly wedge bonder product video in semi-automatic mode

Learn how Questar can help you meet your wire bonding needs.